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LSLT-160™ Low Shrink, Low Temperature Silicone
LSLT-160ä is designed to provide extremely low shrink (.64%) and low 160°F (71°C) cure capability, while maintaining very high tear resistance. Molds can be made from Carved Ferris waxes without special pre-treatment with any kind of release agent. Use Teflon spray with resin models. Do not use with 3-D systems resin models. Use Akron Silicone RTV for 3D models.
Since LSLT-160ä has a high affinity for aluminum and stainless steel mold plates, each box contains a supply of reusable heat resistant release paper. Do not attempt to vulcanize LSLT-160 without using the release liners, as the mold will adhere to the plates. As an alternative you can use our Teflon spray, if you wish. To ensure ease of mold removal, spray the inner edges of the mold frame.
MAKING THE MOLD
Use the heat resistant release paper as a base for your mold. Simply lay the paper on the mold plate under the mold frame. This paper will prevent the rubber from adhering to the mold plate.
Cut enough rubber to fill the mold frame to about ½ full. Work in with your fingers or a blunt tool. Carefully place pieces or rubber within undercuts and delicate sections of the wax model.
Lay the wax model in place and gently fill all voids with pieces of rubber. Carefully cut and place rubber around and over the model. Work in gently with a blunt tool, making sure to over-pack the frame slightly. Remember that if you do not place enough rubber in the frame you will have voids and sponge like holes in your mold.
Place another piece of heat resistant release paper on top of the mold frame. At low temperature settings the parchment paper can be used many times.
Place the finished mold in your pre-heated, carefully calibrated vulcanizer. Lower the platen and exert light pressure slowly to prevent damage to the model. Wait a few minutes and tighten a bit more. Do this several times until the vulcanizer is snug. Do not over-tighten the vulcanizer. Rapid cool the mold in cold water, or let stand at room temperature and cut.
Cure temperature and time for typical 19mm / ¾" mold frame
71°C/160°F for 90 minutes or 30 minutes per ¼" thickness
88°C/190°F for 30 minutes or 10 minutes per ¼" thickness
111°C/250°F and over for 15 minutes or 5 minutes per ¼" thickness
Please note:
After three to five days, an inert powder will appear on mold surfaces. This powder may be wiped off dry, or washed in water. It will not appear again, once the mold is cleaned. The mold may also be used without removing the powder.
Shrink rate is less than 1% (0.64%) for all temperatures
40-42A Durometer
Zero-D Products, Inc.
precision engineered materials solutions
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